发明名称 MULTILAYER PRINTED BOARD AND LAYOUT METHOD FOR MULTILAYER PRINTED BOARD
摘要 According to one embodiment, a multilayer printed board includes an insulating substrate, a differential signal wiring, and anti-pad regions. Distances between peripheries of the pad and a constant potential layer in each of the wiring layers are set so that a capacitance between the constant potential layers and a signal via included in a signal line constituting the differential signal wiring, which has a longer route from a transmission end to a reception end, is smaller than a capacitance between the constant potential layers and another signal via included in the other signal line.
申请公布号 US2016128191(A1) 申请公布日期 2016.05.05
申请号 US201514644622 申请日期 2015.03.11
申请人 Kabushiki Kaisha Toshiba 发明人 FUKUCHI Satoru
分类号 H05K1/11;H05K1/03;H05K3/10;H05K1/02 主分类号 H05K1/11
代理机构 代理人
主权项 1. A multilayer printed board comprising: an insulating substrate made of an insulating material and provided with two or more wiring layers that include a constant potential layer and are disposed thereon in a thickness direction; a differential signal wiring composed of two signal lines arranged in parallel with each other, each of the two signal lines including wiring portions arranged at the different wiring layers, a signal via, and pads, the wiring portion being arranged in a region where the constant potential layer is not arranged in each of the wiring layers, the signal via being connecting between the wiring portions of the different wiring layers, and the pads being respectively arranged at connection positions between the wiring portions and the signal via, within the wiring layers; and anti-pad regions respectively formed between the pads and the constant potential layer in each of the wiring layers, wherein distances between peripheries of the pad and the constant potential layer in each of the wiring layers are set so that a capacitance between the constant potential layers and a signal via included in one of the signal lines constituting the differential signal wiring, which has a longer route from a transmission end to a reception end, is smaller than a capacitance between the constant potential layers and another signal via included in the other one of the signal lines.
地址 Minato-ku JP