发明名称 |
PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT |
摘要 |
In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar. |
申请公布号 |
US2016126219(A1) |
申请公布日期 |
2016.05.05 |
申请号 |
US201514927871 |
申请日期 |
2015.10.30 |
申请人 |
Fairchild Semiconductor Corporation |
发明人 |
ASHRAFZADEH Ahmad R.;ULLAL Vijay G.;CHIANG Justin;KINZER Daniel;DUBE Michael M.;JEON Oseob;WU Chung-Lin;ESTACIO Maria Cristina |
分类号 |
H01L25/065 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
San Jose CA US |