FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF

摘要

Flip-chip on leadframe (FCOL) semiconductor packaging structure and fabrication method thereof are provided. A semiconductor chip with copper pillars formed there-over is provided. A barrier layer is formed on the copper pillars. A solder material is coated on the barrier layer. A layer of soldering flux is coated on the solder material. A leadframe with electric leads formed thereon is provided. An insulating layer is formed an the leadframe and having a plurality of openings to expose portion of the electric leads. The semiconductor chip is placed upside down onto the leadframe to have the soldering flux in contact with the portion of the electric leads exposed in the openings. The solder material flows back to form conductive interconnections between the copper pillars and the portion of the electric leads exposed in the openings. The semiconductor chip is packaged with the leadframe using a mold compound.

主权项

1. A method for fabricating a flip-chip on leadframe (FCOL) semiconductor packaging structure, comprising:
providing a semiconductor chip with a plurality of copper pillars formed over the semiconductor chip; forming a barrier layer on the copper pillar; coating a predetermined amount of solder material on the barrier layer; coating a layer of soldering flux on the solder material; providing a leadframe with electric leads formed on the leadframe; forming an insulating layer on the leadframe and having a plurality of openings, positioned corresponding to the copper pillars, to expose a portion of the electric leads; placing the semiconductor chip upside down onto the leadframe to have the soldering flux in contact with the portion of the electric leads exposed in the openings; flowing hack the solder material to form conductive interconnections between the copper pillars and the portion of the electric leads exposed in the openings; and packaging the semiconductor chip with the leadframe using a mold compound.