| 发明名称 |
SYSTEM FOR COOLING DUAL SIDES OF POWER SEMICONDUCTOR DEVICE |
| 摘要 |
A system for cooling dual sides of power semiconductor devices includes two (2) cooling water flow passages, each of which being bent in the “” or “S” shape, to allow a plurality of power semiconductor devices to be inserted in the cooling water flow passage and to allow each power semiconductor device to be connected to an external device. |
| 申请公布号 |
US2016126160(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514702381 |
申请日期 |
2015.05.01 |
| 申请人 |
HYUNDAI MOBIS CO., LTD. |
发明人 |
JEONG Eui-Soo |
| 分类号 |
H01L23/473;H01L23/492;H05K7/20 |
主分类号 |
H01L23/473 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for cooling dual sides of a power semiconductor device, comprising;
a cooling unit provided for cooling the power semiconductor device, the cooling unit having a bending shape to pressurize an upper surface and a lower surface of the power semiconductor device; and a connecting unit for connecting the power semiconductor device to an external device. |
| 地址 |
Seoul KR |
