INTERPOSER FOR MULTI-CHIP ELECTRONICS PACKAGING

摘要

An interposer for vertically separating device die is disclosed. The interposer includes a compliant layer comprising a plurality of thermally conductive plugs that are physically disconnected within the plane of the compliant layer, where the space between the plugs is filled with a compliant medium. In some embodiments, at least one of the top and bottom surfaces of the compliant layer is coated with a thin layer of electrically insulating material.

主权项

1. An interposer comprising:
a compliant layer having a first surface and a second surface, the compliant layer having (1) a first thermal conductivity along a first direction that extends between the first and second surface and a (2) second thermal conductivity along a first plane that is substantially orthogonal with the first direction, wherein the first thermal conductivity is higher than the second thermal conductivity; and a first layer disposed on the first surface of the compliant layer, the first layer being electrically insulating.