| 发明名称 |
Adhesive Sheet, Method for Manufacturing Semiconductor Device Using Same, Method for Manufacturing Thermal Airflow Sensor Using Same, and Thermal Airflow Sensor |
| 摘要 |
Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy. |
| 申请公布号 |
US2016126127(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201414896084 |
申请日期 |
2014.04.18 |
| 申请人 |
HITACHI AUTOMOTIVE SYSTEMS, LTD. |
发明人 |
IKEO Satoshi;SAGAWA Toshifumi;DOI Ryosuke;KIKUCHI Hiroshi;MUKUNO Hideki |
| 分类号 |
H01L21/683;G01F1/692;G01F1/684;C09J7/00;H01L21/78 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less, the adhesive sheet being divided to correspond to a shape of the adherend, and
adhesion or stickiness being generated or increased by external energy. |
| 地址 |
Ibaraki JP |
