| 发明名称 |
SINGULATION APPARATUS AND METHOD |
| 摘要 |
A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process. |
| 申请公布号 |
US2016126116(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201614994689 |
申请日期 |
2016.01.13 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LIN CHUN-CHENG;TSAI YU-PENG;CHEN MENG-TSE;CHENG MING-DA;LIU CHUNG-SHI |
| 分类号 |
H01L21/67;H01L23/544;H01L21/683 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A singulation apparatus comprising:
a carrier having a deformable portion proximate to a top surface of the carrier configured to receive a semiconductor substrate; a plurality of through holes in the carrier with one end from the top surface; and a plurality of chucks in the through holes, wherein each of the plurality of chucks has a first surface configured to support the semiconductor substrate when the deformable portion is deformed. |
| 地址 |
HSINCHU TW |
