Method of Producing an Interposer with Microspring Contacts

摘要

An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

主权项

1. A method of manufacturing an interposer, comprising:
forming a substrate having a first surface and a second surface substantially parallel to but opposite said first surface, said substrate having a via formed therein and communicatively coupling said first and second surfaces; forming an electrically conductive material within said opening to thereby electrically connect regions on said first and second surfaces; forming a microspring over said substrate, at least a portion of said microspring formed to be in electrical communication with said conductive material formed within said opening; releasing a free portion of said microspring such that said free portion assumes a non-planar profile, in the absence of an external force applied thereto, and is free to deflect over said substrate at least a portion of said microspring remaining in electrical communication with said conductive material; forming a laminate structure over said substrate such that said microspring is at least partially embedded within said laminate structure; and processing said substrate such that said conductive material is exposed for electrical contact at said second surface of said substrate to thereby provide electrical contact to said microspring from said second surface of said substrate.