| 发明名称 |
LIGHT EMITTING DEVICE AND LIGHTING SYSTEM |
| 摘要 |
Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided throughprovided through the insulating layer to electrically connect the second branch electrode to the contact layer. |
| 申请公布号 |
US2016126413(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514930164 |
申请日期 |
2015.11.02 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM Sung Kyoon;NA Min Gyu;KIM Myeong Soo |
| 分类号 |
H01L33/10;H01L33/12;H01L33/38;H01L33/30;H01L33/42;H01L33/08;H01L33/06;H01L33/14 |
主分类号 |
H01L33/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device comprising:
a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; an contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided through the insulating layer to electrically connect the second branch electrode to the contact layer. |
| 地址 |
Seoul KR |
