OPTICAL MODULE PACKAGE AND ITS PACKAGING METHOD

摘要

An optical module package includes a substrate having a recessed portion, a cover covered on the substrate and defining with the substrate a first chamber and a second chamber therebetween, the cover having a light-emitting hole disposed in communication with the first chamber, a light-receiving hole disposed in communication with the second chamber and a stop wall positioned in the recessed portion to separate the first chamber and the second chamber, a light-emitting chip and a light-receiving chip mounted at the substrate and respectively disposed in the first chamber and the second chamber, and two encapsulation colloids respectively mounted in the first chamber and the second chamber and respectively wrapped about the light-emitting chip and the light-receiving chip. Thus, the optical module package not only can prevent crosstalk but also can greatly reduce the manufacturing cost and the level of difficulty.

主权项

1. An optical module package, comprising:
a substrate comprising a light-emitting region and a light-receiving region located at one same datum line, and a recessed portion disposed between said light-emitting region and said light-receiving region beneath said datum line; a cover mounted on said substrate and defining with said substrate a first chamber and a second chamber therebetween, said cover comprising a light-emitting hole disposed in communication with said first chamber, a light-receiving hole disposed in communication with said second chamber, and a stop wall positioned in said recessed portion to separate said first chamber and said second chamber; a light-emitting chip mounted in said light-emitting region within said first chamber; a light-receiving chip mounted in said light-receiving region within said second chamber; and two encapsulation colloids respectively disposed in said first chamber and said second chamber and respectively wrapped about said light-emitting chip and said light-receiving chip.