发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 A printed circuit board includes a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate, and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being spaced apart from a side surface of the core part by a predetermined distance.
申请公布号 US2016128186(A1) 申请公布日期 2016.05.05
申请号 US201514857817 申请日期 2015.09.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO Suk Hyeon;BAEK Yong Ho;KO Young Gwan;OH Yoong;KO Young Kuk
分类号 H05K1/03;H05K3/10;H05K3/00;H05K1/11 主分类号 H05K1/03
代理机构 代理人
主权项 1. A printed circuit board comprising: a core part comprising a glass core and a resin layer disposed on an upper surface and a lower surface of the glass core; and a wiring layer disposed on the core part, wherein a groove part is formed in the glass core, the groove part penetrating the glass core between one surface and the other surface of the glass core.
地址 Suwon-Si KR