发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A printed circuit board includes a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate, and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being spaced apart from a side surface of the core part by a predetermined distance. |
申请公布号 |
US2016128186(A1) |
申请公布日期 |
2016.05.05 |
申请号 |
US201514857817 |
申请日期 |
2015.09.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO Suk Hyeon;BAEK Yong Ho;KO Young Gwan;OH Yoong;KO Young Kuk |
分类号 |
H05K1/03;H05K3/10;H05K3/00;H05K1/11 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
1. A printed circuit board comprising:
a core part comprising a glass core and a resin layer disposed on an upper surface and a lower surface of the glass core; and a wiring layer disposed on the core part, wherein a groove part is formed in the glass core, the groove part penetrating the glass core between one surface and the other surface of the glass core. |
地址 |
Suwon-Si KR |