SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP

摘要

A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

主权项

1. A semiconductor package having a Package On Package (POP) structure, comprising:
a first package comprising a first semiconductor chip mounted on a first substrate; a second package arranged on the first package and comprising a second semiconductor chip mounted on a second substrate; and an interconnection member electrically connecting the first substrate and the second substrate, wherein at least one first pad for a data input/output channel and the same number of second pads for control/address channels as that of the at least one first pad are arranged in the first semiconductor chip, the at least one first pad is arranged in an edge region of the first semiconductor chip, and the second pad is arranged in a center region of the first semiconductor chip.