发明名称 |
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE |
摘要 |
A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames, so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portions can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance. |
申请公布号 |
US2016126167(A1) |
申请公布日期 |
2016.05.05 |
申请号 |
US201514956474 |
申请日期 |
2015.12.02 |
申请人 |
DENSO CORPORATION |
发明人 |
ISHINO Hiroshi;WATANABE Tomokazu |
分类号 |
H01L23/495;H01L21/56;H01L23/31;H01L21/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Kariya-city JP |