发明名称 |
MICROPHONE PACKAGE WITH MOLDED SPACER |
摘要 |
A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate. |
申请公布号 |
US2016127838(A1) |
申请公布日期 |
2016.05.05 |
申请号 |
US201514924789 |
申请日期 |
2015.10.28 |
申请人 |
Robert Bosch GmbH |
发明人 |
Salmon Jay Scott;Saxena Kuldeep |
分类号 |
H04R19/00;H04R1/06;H04R19/04 |
主分类号 |
H04R19/00 |
代理机构 |
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代理人 |
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主权项 |
1. A microelectromechanical system (MEMS) microphone package comprising:
a MEMS microphone die configured to sense acoustic pressure and to generate an electrical signal based on the sensed acoustic pressure; an application specific integrated circuit (ASIC) electrically connected to the MEMS microphone die, the ASIC configured to receive the electrical signal from the MEMS microphone die; a substrate including electrical connection pads; a conductive lid including an acoustic input port; and a package spacer having a top surface and a bottom surface, the top surface connected to the conductive lid and the bottom surface secured to the substrate, the package spacer formed of a molded material. |
地址 |
Stuttgart DE |