发明名称 TRANSISTOR STRUCTURES AND FABRICATION METHODS THEREOF
摘要 Transistor structures and methods of fabricating transistor structures are provided. The methods include: fabricating a transistor structure at least partially within a substrate, the fabricating including: providing a cavity within the substrate; and forming a first portion and a second portion of the transistor structure at least partially within the cavity, the first portion being disposed at least partially between the substrate and the second portion, where the first portion inhibits diffusion of material from the second portion into the substrate. In one embodiment, the transistor structure is a field-effect transistor structure, and the first portion and the second portion include one of a source region or a drain region of the field-effect transistor structure. In another embodiment, the transistor structure is a bipolar junction transistor structure.
申请公布号 US2016126316(A1) 申请公布日期 2016.05.05
申请号 US201414526831 申请日期 2014.10.29
申请人 GLOBALFOUNDRIES Inc. 发明人 WU Xusheng;LIU Jin Ping;CHI Min-hwa
分类号 H01L29/165;H01L29/737;H01L21/324;H01L29/66;H01L29/167;H01L21/02;H01L29/78;H01L29/08 主分类号 H01L29/165
代理机构 代理人
主权项 1. A method comprising: fabricating a transistor structure at least partially within a substrate, the fabricating comprising: providing a cavity within the substrate; andforming a first portion and a second portion of the transistor structure at least partially within the cavity, the first portion being disposed at least partially between the substrate and the second portion, wherein the first portion inhibits diffusion of material from the second portion into the substrate.
地址 Grand Cayman KY