| 发明名称 |
CHIP ELECTRONIC COMPONENT |
| 摘要 |
A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 μm to 10 μm. |
| 申请公布号 |
US2016126004(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514885812 |
申请日期 |
2015.10.16 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YANG Yun Young;CHOI Youn Kyu;KIM Hye Ah;KANG Do Won;KANG Mi Jung |
| 分类号 |
H01F27/28;H01F27/02;H01F27/24 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip electronic component comprising:
a magnetic body containing a magnetic metal powder; internal coil parts embedded in the magnetic body; and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body, wherein the anti-plating layer contains a magnetic metal powder having particle sizes within the range of 0.1 μm to 10 μm. |
| 地址 |
Suwon-Si KR |
