Heat radiation apparatus for LED lighting

摘要

A heat radiation apparatus (1) for LED lighting includes an LED lighting unit mounting plate (2) formed of a thermally conductive material and which has a lighting unit mounting surface (3) to which an LED lighting unit (6) is mounted and a flat heat transfer surface (4), and a plurality of heat radiation fins (5) disposed on the heat transfer surface (4). Each heat radiation fin (5) has a base portion (7) which is fixed to the heat transfer surface (4) and receives heat therefrom, and heat radiation portions (8) which extend upward from the base portion (7). The heat radiation fins (5) are fixed to the LED lighting unit mounting plate (2) such that the heat radiation portions (8) are spaced from one another. Each heat radiation portion (8) has a heat pipe portion (11) formed by charging an operation fluid into an operation fluid storing circuit (12).