发明名称 |
SILICONE RESIN, RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND MAKING METHOD |
摘要 |
A silicone resin comprising constitutional units represented by formula (1) and having a Mw of 3,000-500,000 contains 10-50 wt% of (A-1) a first silicone resin having a silicone content of 10-40 wt% and (A-2) a second silicone resin having a silicone content of 50-80 wt%. A resin composition comprising the silicone resin can be formed in film form, and it possesses satisfactory covering or encapsulating performance to large size/thin wafers. The resin composition or resin film ensures satisfactory adhesion, low warpage, and wafer protection. The resin film is useful in wafer-level packages. |
申请公布号 |
EP3015499(A1) |
申请公布日期 |
2016.05.04 |
申请号 |
EP20150188898 |
申请日期 |
2015.10.08 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KONDO, KAZUNORI;ICHIOKA, YOICHIRO;KATO, HIDETO |
分类号 |
C08K3/36;C08G77/14;C08G77/48;C08G77/50;C08G77/52;C08L63/00;C08L83/14;C09D183/14;H01L23/29 |
主分类号 |
C08K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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