| 摘要 |
The present invention relates to a solder supply device. The solder supply device comprises: a first fixing unit (10) installed on a surface of a soldering device (90); a first bar (20) installed on one upper side of the first fixing unit (10); a moving unit (21) formed in an upper portion of the first bar (20); a second bar (30); an object (40) pushing the solder formed on a front side of the second bar (30); a tension spring (22) formed between the first bar (20) and the second bar (30); a torsion spring (23) formed between lower portions of the first fixing unit (10) and the first bar (20); a plate (24) formed on one rear side of the first bar (20); a protrusion (41) formed in the lower portion of the object (40) pushing solder; a solder guide pipe (50) formed on a front side of the first fixing unit (10), a pulley (70); and a second fixing unit (60) formed in a lower portion of a pulley (70). The present invention can improve work efficiency. |
