| 摘要 |
An imaging module 40 includes a solid-state imaging element 44 including a light receiving face, a multi-layer substrate 46, which includes a connection portion 461 which is located inside an imaging element projection area that is a projection area where the solid-state imaging element 44 is projected in an optical axis direction and which is connected and fixed to a back surface of the solid-state imaging element 44 on a distal end side thereof, whose rear end portion is extended to be arranged in the optical axis direction, and on which electronic components 55 to 57 are mounted, and a metallic reinforcing member 52 which has a sleeve shape open at both ends and which covers the solid-state imaging element 44 and the connection portion 461 of the multi-layer substrate 46 along the optical axis direction in a state in which an inner circumferential surface thereof is away from the solid-state imaging element 44 and the multi-layer substrate 46. The multi-layer substrate 46 includes protrusion portions 462u and 462d, which protrude outside of the imaging element projection area in a state in which the protrusion portions are away from a rear end of the reinforcing member 52 by a specified distance or more, on a rear end side with respect to the connection portion 461. |
