| 摘要 |
An electrical connection arrangement between at least one flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, or laminated pane, with electric or electronic components, the cable being an integral part of an external connection. The flat conductor or conductor portion is further formed on a carrier film, or polyimide film, and includes an encapsulation as a plastic injection overmolding at least in an area of the electric contacting point of cable and flat conductor or conductor portion. An adhesion-promoting, heat-activated adhesive film is applied in the area of the carrier film while leaving space for the electrical contacting point, yet surrounding or two-dimensionally delimiting same, wherein, after forming the electrical connection at the contacting point, the plastic injection overmolding is performed and pressure and temperature input simultaneously activates the adhesive film to realize a highly dense and durable bonding. |
