发明名称 |
COMPOSITION FOR FORMING CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN BY USING SAME, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN |
摘要 |
The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 µm; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. |
申请公布号 |
EP3016110(A1) |
申请公布日期 |
2016.05.04 |
申请号 |
EP20150780194 |
申请日期 |
2015.04.16 |
申请人 |
LG CHEM, LTD. |
发明人 |
JUN, SHIN HEE;KIM, JAE HYUN;PARK, CHEOL-HEE;PARK, CHEE-SUNG;KIM, JAE JIN;JEONG, HAN NAH;SEONG, EUN KYU;LEE, SU JEONG |
分类号 |
C23C18/18;C08K3/22;C08L69/00;C23C18/30;C23C18/40;H01B1/22;H01B13/00 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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