Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package

摘要

A computer-implemented structure for optimizing a route for power supply and heat dissipation in a multilayer chip. The method includes: setting a heat conductive thermal value for the multilayer chip by way of density, preparing a substrate that contains silicon where a wiring layer is formed facing the upper surface side of the multilayer chip, setting the power from the wiring layer of the substrate that uses silicon, manipulating the value of the power supply, and manipulating the heat conductive thermal value based on density. Both apparatuses include an organic substrate, a multilayer chip, a substrate containing silicon, a wiring layer, and a heat dissipater, wherein the components are configured to perform the steps of the above method. The method of configuring an apparatus ensures that all the multilayer chips are stored in the concave part of the organic substrate.

主权项

1. An apparatus that performs power supply and heat dissipation for a stacked multiple-chip structure from an upper surface side of said stacked multiple-chip structure, comprising:
an organic substrate provided on a lower surface side of said stacked multiple-chip structure; a substrate that uses silicon (Si) where a wiring layer, with a thickness, is formed on a bottom surface side facing said upper surface side of said stacked multiple-chip structure; a heat dissipater located on said substrate that uses Si that dissipates heat directly above the upper surface side of said substrate that uses Si; said organic substrate and said wiring layer formed on said substrate that uses Si are electrically connected in a periphery of said apparatus; and said stacked multiple-chip structure, on said upper surface side, is adapted to receive power through said wiring layer.