Field-replaceable bank of immersion-cooled electronic components

摘要

A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

主权项

1. A cooled electronic system comprising:
an electronic system comprising a field-replaceable bank of electronic components, the electronic components of the field-replaceable bank of electronic components comprising multiple substrates with components mounted thereto; and a cooling apparatus facilitating cooling of the field-replaceable bank of electronic components, the cooling apparatus comprising:
an enclosure at least partially surrounding and forming a compartment about, at least in part, the electronic components of the field-replaceable bank of electronic components, and the substrates of the electronic components of the field-replaceable bank of electronic components extending, in part, through respective openings in the enclosure and operatively docking into respective receiving sockets of the electronic system external to the enclosure;a fluid disposed within the compartment, the electronic components of the field-replaceable bank of electronic components being, at least partially, immersed within the compartment in the fluid to facilitate immersion-cooling thereof; anda heat sink attached to or integrated with the enclosure, the heat sink facilitating rejection of heat from the fluid disposed within the compartment.