Semiconductor package and method for fabricating the same

摘要

A semiconductor package includes a package substrate on which a substrate pad is disposed, a structure disposed over the package substrate, a semiconductor chip disposed over the structure using an adhesive member having a magnetic material layer disposed therein, a chip pad disposed on a top surface of the semiconductor chip, and a bonding wire coupling the substrate pad and the chip pad.

主权项

1. A semiconductor package comprising:
a package substrate on which a substrate pad is disposed; a structure disposed over the package substrate; a semiconductor chip attached to the structure using an adhesive member, the adhesive member having a magnetic material layer disposed therein; a chip pad disposed on a top surface of the semiconductor chip; and a bonding wire coupling the substrate pad and the chip pad.