| 发明名称 | Tantalum capacitor and method of manufacturing the same | ||
| 摘要 | There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame. | ||
| 申请公布号 | US9330852(B2) | 申请公布日期 | 2016.05.03 |
| 申请号 | US201414168908 | 申请日期 | 2014.01.30 |
| 申请人 | SAMSUNG ELECTRO-MECHANICS CO., LTD. | 发明人 | Kwak Sung Ho;Jung Hun Chol;Hong Jeong Oh;Cha Sung Soo;Myung Hee Dong;Choi Hee Sung |
| 分类号 | H01G9/042;H01G9/15;H01G9/00;H01G9/012;H01G9/08 | 主分类号 | H01G9/042 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A tantalum capacitor comprising: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part, a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire, and an extension part having an area extended in a width direction of the capacitor body; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame. | ||
| 地址 | Suwon-si, Gyeonggi-do KR | ||