Method for manufacturing a die assembly having a small thickness and die assembly relating thereto

摘要

A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.

主权项

1. A die assembly comprising:
a first die including a semiconductor body and an integrated electronic circuit and having first and second sides that extend between first and second surfaces; a recess formed in the first surface of the first die; a second die of semiconductor material bonded to the second surface of the first die, the second die not including electrical functions and providing stiffening structural support to the first die; a third die bonded to the first surface of the first die, the first die being arranged between the second and third dice, the third die including a micro-electromechanical sensing structure; and a molding compound coating the first and second sides of the first die.