发明名称 |
Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device |
摘要 |
Thin film photovoltaic devices that include at least one lead bar extending through a connection aperture defined in the encapsulation substrate are provided. The photovoltaic device can include: a transparent substrate; a plurality of photovoltaic cells on the transparent substrate; a first conductive ribbon electrically connected to a first photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; and, a first lead bar extending through a first connection aperture defined in the encapsulation substrate. The first lead bar is electrically connected to the first conductive ribbon. For example, a meltable conductive material can be connected to the first lead bar and to the first conductive ribbon to establish an electrical connection therebetween. Methods are also provided for electrically connecting a lead to a thin film photovoltaic device. |
申请公布号 |
US9331631(B2) |
申请公布日期 |
2016.05.03 |
申请号 |
US201213600815 |
申请日期 |
2012.08.31 |
申请人 |
First Solar, Inc. |
发明人 |
Clark Kim James;Reed Max William;Crume Bradley Robert;Berens Troy Alan |
分类号 |
H01L31/05;H01L31/02;H02S40/34 |
主分类号 |
H01L31/05 |
代理机构 |
MacMillan, Sobanski & Todd, LLC |
代理人 |
MacMillan, Sobanski & Todd, LLC |
主权项 |
1. A thin film photovoltaic device, comprising:
a transparent substrate; a plurality of photovoltaic cells on the transparent substrate; a first conductive ribbon electrically connected to a first photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; a first lead bar extending through a first connection aperture defined in the encapsulation substrate, wherein the first lead bar is electrically connected to the first conductive ribbon; and, a meltable conductive material connected to the first lead bar and to the first conductive ribbon to establish an electrical connection therebetween; and a back plate adhered to an exposed surface of the encapsulation substrate that is opposite of the transparent substrate, wherein the back plate defines a support aperture and is positioned such that the first lead bar extends through the support aperture. |
地址 |
Tempe AZ US |