| 摘要 |
The present invention relates to a method for manufacturing a flexible printed circuit board, which comprises: a first step of preparing a copper clad laminate obtained by laminating copper on one surface or both surfaces of polyimide; a second step of forming a circuit pattern by selectively removing the copper of the copper clad laminate; a third step of processing a hole by wet-etching the polyimide, exposed to a portion from which the copper is removed, by using a polyimide etchant including alkali salts, hydrazine derivatives, amine compounds, fluorinated surfactants and water; and a fourth step of plating the hole with copper. |
