发明名称 |
Semiconductor device with diffusion barrier film and method of manufacturing the same |
摘要 |
A method of forming a diffusion barrier film over fins and the resulting device are provided. Embodiments include forming silicon fins over a substrate; depositing a borosilicate glass (BSG) liner cap over a first set of the silicon fins; depositing a phosphosilicate (PSG) liner cap over a second set of the silicon fins; and depositing a silicon oxycarbide (SiOC) diffusion barrier film over the BSG and PSG liner caps. |
申请公布号 |
US9330982(B1) |
申请公布日期 |
2016.05.03 |
申请号 |
US201514826276 |
申请日期 |
2015.08.14 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Cao Huy;Srivathanakul Songkram;Liu Jinping;Jung In Soo |
分类号 |
H01L21/8238;H01L21/02;H01L21/324;H01L27/092 |
主分类号 |
H01L21/8238 |
代理机构 |
Ditthavong & Steiner, P.C. |
代理人 |
Ditthavong & Steiner, P.C. |
主权项 |
1. A method comprising:
forming silicon fins over a substrate; depositing a borosilicate glass (BSG) liner cap over a first set of the silicon fins;depositing a phosphosilicate glass (PSG) liner cap over a second set of the silicon fins; and
depositing a silicon oxycarbide (SiOC) diffusion barrier film over the BSG and PSG liner caps. |
地址 |
Grand Cayman KY |