发明名称 Semiconductor device with diffusion barrier film and method of manufacturing the same
摘要 A method of forming a diffusion barrier film over fins and the resulting device are provided. Embodiments include forming silicon fins over a substrate; depositing a borosilicate glass (BSG) liner cap over a first set of the silicon fins; depositing a phosphosilicate (PSG) liner cap over a second set of the silicon fins; and depositing a silicon oxycarbide (SiOC) diffusion barrier film over the BSG and PSG liner caps.
申请公布号 US9330982(B1) 申请公布日期 2016.05.03
申请号 US201514826276 申请日期 2015.08.14
申请人 GLOBALFOUNDRIES INC. 发明人 Cao Huy;Srivathanakul Songkram;Liu Jinping;Jung In Soo
分类号 H01L21/8238;H01L21/02;H01L21/324;H01L27/092 主分类号 H01L21/8238
代理机构 Ditthavong & Steiner, P.C. 代理人 Ditthavong & Steiner, P.C.
主权项 1. A method comprising: forming silicon fins over a substrate; depositing a borosilicate glass (BSG) liner cap over a first set of the silicon fins;depositing a phosphosilicate glass (PSG) liner cap over a second set of the silicon fins; and depositing a silicon oxycarbide (SiOC) diffusion barrier film over the BSG and PSG liner caps.
地址 Grand Cayman KY