发明名称 Three dimensional stacked nonvolatile semiconductor memory
摘要 A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one.
申请公布号 US9330761(B2) 申请公布日期 2016.05.03
申请号 US201414460400 申请日期 2014.08.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Maejima Hiroshi
分类号 G11C16/04;G11C5/02;G11C5/06;G11C16/08;H01L27/115 主分类号 G11C16/04
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P
主权项 1. A nonvolatile semiconductor memory comprising: a first unit including a first memory cell and a first selection transistor in a first block; a second unit including a second memory cell and a second selection transistor in a second block, a gate of the second selection transistor being electrically connected to a gate of the first selection transistor; a first line electrically connected to a gate of the first memory cell; a second line electrically connected to a gate of the second memory cell; and a third line electrically connected to gates of the first and second selection transistors, the gate of the first selection transistor being connected to the gate of the second selection transistor without intervention of any transistors.
地址 Minato-ku JP