发明名称 Server systems having segregated power circuits for high availability applications
摘要 A method for replacing or repairing a non hot swappable component according to one embodiment includes supplying power to a first motherboard partition, a first storage partition, a second motherboard partition, and a second storage partition concurrently. The first storage partition is accessed and utilized with the second motherboard partition. The power to the first motherboard partition s selectively severed, and a non hot swappable component that has failed is removed from the first motherboard partition and replaced with a functioning component. Power is restored to the first motherboard partition.
申请公布号 US9329653(B2) 申请公布日期 2016.05.03
申请号 US201414312512 申请日期 2014.06.23
申请人 International Business Machines Corporation 发明人 Dain Joseph W.
分类号 G06F1/26;H02J9/06 主分类号 G06F1/26
代理机构 Zilka-Kotab, PC 代理人 Zilka-Kotab, PC
主权项 1. A method for replacing or repairing a non hot swappable component, the method comprising: supplying power to a first motherboard partition, a first storage partition, a second motherboard partition, and a second storage partition concurrently, wherein the first motherboard partition comprises a first motherboard and a first processor capable of accessing a first memory in the first storage partition, wherein the second motherboard partition comprises a second motherboard and a second processor capable of accessing a second memory in the second storage partition, wherein the first motherboard partition and the first storage partition are part of a first system, wherein the second motherboard partition and the second storage partition are part of a second system, the second system being external to the first system and connected to the first system via an external connection extending between the first system and the second system: wherein the first processor is capable of accessing the second memory, and wherein the second processor is capable of accessing the first memory; accessing and utilizing the first storage partition with the second motherboard partition; selectively severing the power to the first motherboard partition; removing a non hot swappable component that has failed from the first motherboard partition: replacing the non hot swappable component in the first motherboard partition with a functioning component; and restoring power to the first motherboard partition.
地址 Armonk NY US