Semiconductor device

摘要

In a semiconductor device, a conductor pattern is disposed in a position overlapped by a semiconductor chip in a thickness direction over the mounting surface (lower surface) of a wiring board. A solder resist film (insulating layer) covering the lower surface of the wiring board has apertures formed such that multiple portions of the conductor pattern are exposed. The conductor pattern has conductor apertures. The outlines of the apertures and the conductor apertures overlap with each other, in a plan view, respectively.

主权项

1. A semiconductor device, comprising:
(a) a wiring board including: a first insulating layer including a first surface, and a second surface opposite to the first surface, a first pattern formed on the second surface, a plurality of second patterns formed on the second surface and also arranged around the first pattern in plan view, and a second insulating layer formed over the second surface of the first insulating layer; (b) a semiconductor chip mounted over the first surface of the first insulating layer, and also including: a plurality of pads (PD) electrically connected with the plurality of second patterns, respectively, wherein the second insulating layer has a plurality of first apertures and a plurality of second apertures, wherein the plurality of first apertures expose a plurality of first parts of the first pattern and a plurality of first parts of the first insulating layer, respectively, and wherein the plurality of second apertures expose the plurality of the second patterns and a plurality of second parts of the first insulating layer, respectively.