Electronic component built-in substrate and method of manufacturing the same

摘要

An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer.

主权项

1. An electronic component built-in substrate, comprising:
a substrate having an opening portion; a first wiring layer formed on the substrate; an electronic component arranged in the opening portion; a first insulating layer formed on one face of the substrate and sealing the electronic component; a second insulating layer formed on other face of the substrate; a second wiring layer formed on the first insulating layer; and a third wiring layer formed on the second insulating layer, wherein the first insulating layer is formed of an inner insulating layer covering a whole of the one face of the substrate, one face of the electronic component and the first wiring layer, the inner insulating layer filling a space between a side wall of the opening portion and a side wall of the electronic component, and an outer insulating layer formed to contact a whole of one face of the inner insulating layer.