Display panel and method of manufacturing the same

摘要

A display panel includes an array substrate, an opposite substrate facing the array substrate, and a liquid crystal layer disposed between the array substrate and the opposite substrate. The array substrate includes a display area and a non-display area surrounding the display area, and the non-display area includes a first non-display area disposed adjacent to a side portion of the display area and a second non-display area other than the first non-display area. The first non-display area overlaps the opposite substrate. The array substrate and the opposite substrate have the same or substantially the same area and a wire member is disposed under the array substrate to be connected to an external circuit module. Accordingly, the display panel does not need an extra space for the wire member, and thus the non-display area is reduced.

主权项

1. A display panel comprising:
an array substrate including a display area and a non-display area surrounding the display area, wherein the non-display area includes a first non-display area adjacent to a side portion of the display area and a second non-display area; an opposite substrate facing the array substrate; and a liquid crystal layer between the array substrate and the opposite substrate, wherein the first non-display area comprises a wire area adjacent to the display area and a pad area and the pad area overlaps the opposite substrate, and wherein the array substrate comprises:
a base substrate in the display area, the second non-display area, and the wire area;a thin film transistor on the base substrate in the display area;a pixel electrode connected to the thin film transistor;a signal input pad in the pad area, wherein the signal input pad is electrically connected to a driver IC (Integrated Circuit), wherein the signal input pad includes an upper surface and a lower surface, and the lower surface is further apart from the opposite substrate in comparison with the upper surface; anda signal wire in the wire area, wherein the signal wire connects the signal input pad with the thin film transistor, and wherein the signal input pad is electrically connected to the driver IC through a flexible printed circuit board disposed under the array substrate and attached on the lower surface of the signal input pad.