| 摘要 |
The present invention relates to a phosphonium compound represented by chemical formula 1. In the chemical formula 1, R_1, R_2, R_3, and R_4 each independently indicate a substituted or unsubstituted C1-C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6-C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1-C30 hydrocarbon group including a heteroatom; X indicates a substituted or unsubstituted arylene group having 6 to 30 carbon atoms, a substituted or unsubstituted cycloalkylene group having 3-10 carbon atoms, or a substituted or unsubstituted alkylene group having 1-20 carbon atoms; R_5 indicates hydrogen, a hydroxyl group, a C1-C20 alkyl group, a C6-C30 aryl group, a C3-C30 heteroaryl group, a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C7-C30 arylalkyl group, or a C1-C30 heteroalkyl group; and m indicates an integer ranging from 0 to 5. The phosphonium compound may provide a curing accelerating compound which can promote curing of an epoxy resin; has an excellent flexibility in molding; has a high curing strength; and can perform curing in a short period of time. |
