APPARATUS FOR TRANSFERRING A WAFER

摘要

The present invention provides a wafer transfer device which can transfer a wafer to a processing facility while arranging the wafer supported by an auxiliary ring. The wafer transfer device transfers the wafer one by one from a cartridge on which the multiple wafers are mounted, to the processing facility, wherein the wafers are bonded to a bonding film by being sewed by multiple dies and are supported by the auxiliary ring gripping the bonding film on the periphery thereof. The wafer transfer device includes a transfer plate, a transfer arm, and a wafer arrangement unit. The transfer plate supports the lower part of the wafer. The transfer arm is connected to the transfer plate to transfer the wafer supported by the transfer plate to the processing facility. The wafer arrangement unit is installed in the transfer plate and arranges the wafer by guiding the position of the auxiliary ring to a predetermined direction when the wafer is supported.