| 摘要 |
According to a technical concept of the present invention, a semiconductor package comprises: a package substrate; a first semiconductor chip having a plurality of first connection terminals in a lower portion thereof; and a second semiconductor chip having a plurality of second connection terminals in a lower portion thereof. The first semiconductor chip is laminated so that a first group of the plurality of first connection terminals is electrically connected onto the package substrate. The second semiconductor chip is arranged so that the second connection terminals are electrically connected to a second group of the plurality of first connection terminals, which is not electrically connected to the package substrate. |
