发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
To manufacture a highly reliable semiconductor device by giving stable electric characteristics to a transistor. An oxide semiconductor film is deposited by a sputtering method with the use of a polycrystalline sputtering target. In that case, partial pressure of water in a deposition chamber before or in the deposition is set to be lower than or equal to 10−3 Pa, preferably lower than or equal to 10−4 Pa, more preferably lower than or equal to 10−5 Pa. Thus, a dense oxide semiconductor film is obtained. The density of the oxide semiconductor film is higher than 6.0 g/cm3 and lower than 6.375 g/cm3. |
申请公布号 |
US9331156(B2) |
申请公布日期 |
2016.05.03 |
申请号 |
US201213710867 |
申请日期 |
2012.12.11 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
Yamazaki Shunpei;Akimoto Kengo;Nonaka Yusuke;Kanemura Hiroshi |
分类号 |
H01L29/10;H01L29/24;H01L21/02;H01L29/786;H01L29/04;H01L27/12 |
主分类号 |
H01L29/10 |
代理机构 |
Robinson Intellectual Property Law Office |
代理人 |
Robinson Intellectual Property Law Office ;Robinson Eric J. |
主权项 |
1. A semiconductor device comprising:
a gate electrode layer; a gate insulating layer over the gate electrode layer; a non-single-crystal oxide semiconductor film as a channel formation region over the gate insulating layer; and an insulating layer over the channel formation region, wherein the non-single-crystal oxide semiconductor film comprises a crystal part, wherein a concentration of chlorine in the non-single-crystal oxide semiconductor film is lower than or equal to 2×1018 atoms/cm3, and wherein the non-single-crystal oxide semiconductor film has a density of higher than 6.0 g/cm3. |
地址 |
Kanagawa-ken JP |