发明名称 Semiconductor device and method for manufacturing the same
摘要 To manufacture a highly reliable semiconductor device by giving stable electric characteristics to a transistor. An oxide semiconductor film is deposited by a sputtering method with the use of a polycrystalline sputtering target. In that case, partial pressure of water in a deposition chamber before or in the deposition is set to be lower than or equal to 10−3 Pa, preferably lower than or equal to 10−4 Pa, more preferably lower than or equal to 10−5 Pa. Thus, a dense oxide semiconductor film is obtained. The density of the oxide semiconductor film is higher than 6.0 g/cm3 and lower than 6.375 g/cm3.
申请公布号 US9331156(B2) 申请公布日期 2016.05.03
申请号 US201213710867 申请日期 2012.12.11
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 Yamazaki Shunpei;Akimoto Kengo;Nonaka Yusuke;Kanemura Hiroshi
分类号 H01L29/10;H01L29/24;H01L21/02;H01L29/786;H01L29/04;H01L27/12 主分类号 H01L29/10
代理机构 Robinson Intellectual Property Law Office 代理人 Robinson Intellectual Property Law Office ;Robinson Eric J.
主权项 1. A semiconductor device comprising: a gate electrode layer; a gate insulating layer over the gate electrode layer; a non-single-crystal oxide semiconductor film as a channel formation region over the gate insulating layer; and an insulating layer over the channel formation region, wherein the non-single-crystal oxide semiconductor film comprises a crystal part, wherein a concentration of chlorine in the non-single-crystal oxide semiconductor film is lower than or equal to 2×1018 atoms/cm3, and wherein the non-single-crystal oxide semiconductor film has a density of higher than 6.0 g/cm3.
地址 Kanagawa-ken JP