Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC

摘要

A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.

主权项

1. A thermosetting polymer composite comprising a thermosetting polymer matrix material, a filler selected from the group consisting of particulate fillers, fiber, and combinations thereof, and from about 0.1 to about 5 weight percent of reduced-volume hollow shape-memory alloy particles having a maximum length of from about 1 micrometer to about 100 micrometers, wherein the reduced-volume hollow shape-memory alloy particles undergo irreversible volume expansion during a thermal process to compensate for a volume loss of the cured thermosetting polymer matrix material and the reduced-volume hollow shape-memory alloy particles have a trained shape selected from the group consisting of hollow microspheres, hollow micro-ellipsoids, hollow micro-tubes, and combinations thereof.