发明名称 Vibrator with a beam-shaped portion above a recess in a substrate, and oscillator using same
摘要 A method for manufacturing a vibrator according to the present invention includes: forming a coating layer that covers a silicon substrate; patterning the coating layer; forming a semiconductor layer that covers the silicon substrate and the coating layer; forming a vibrating portion having a beam shape on the coating layer and a support portion that supports the vibrating portion by patterning the semiconductor layer; forming an opening that exposes the silicon substrate; forming a recess portion by removing the silicon substrate through the opening; and removing the coating layer. In the step of forming the vibrating portion and the support portion, the support portion having a first portion that is located on the silicon substrate, and a second portion that connects the first portion and the vibrating portion and is located on the coating layer is formed.
申请公布号 US9331668(B2) 申请公布日期 2016.05.03
申请号 US201414218053 申请日期 2014.03.18
申请人 SEIKO EPSON CORPORATION 发明人 Yoshizawa Takahiko
分类号 H03H9/24;H03H9/17;H03H9/02;H03B5/30;H03B5/02;H03H3/02 主分类号 H03H9/24
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A vibrator comprising: a silicon substrate having a recess portion formed from a surface thereof; and a semiconductor layer having: a beam-shaped vibrating portion that is formed above the recess portion with a gap interposed therebetween; anda support portion that is formed on the surface and supports the vibrating portion, the support portion including: a first portion that is fixed to the surface; anda second portion that connects the first portion and the vibrating portion and is formed above the surface with a gap interposed between the surface and the second portion, wherein the vibrating portion extends in a first direction from the second portion, and a dimension in a second direction of the second portion is greater than a dimension in the second direction of the vibrating portion, the second direction being a direction intersecting the first direction.
地址 Tokyo JP