Semiconductor package assembly with decoupling capacitor

摘要

A semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package.

主权项

1. A semiconductor package assembly, comprising:
a first semiconductor package, comprising: a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface; and a second semiconductor package bonded to the first device-attach surface of the first semiconductor package, wherein the second semiconductor package comprises: a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface; a dynamic random access memory (DRAM) device mounted on the second device-attach surface; a decoupling capacitor directly mounted on dummy metal pads and circuitry of the second device-attach surface of the second body, and coupled to the first semiconductor package; and conductive structures disposed on the second bump-attach surface of the second semiconductor package, connecting to the first device-attach surface of the first body of the first semiconductor package.