| 摘要 |
A buffer station for thermal control of semiconductor substrates in a semiconductor substrate processing system interfaces with a first vacuum transfer module and a second vacuum transfer module of the system to allow the substrates to be transferred between the vacuum transfer modules. The buffer station comprises: a first vacuum module interface which is configured to allow the substrates to be transferred between the first vacuum transfer module and the buffer station; and a second vacuum transfer module interface which is configured to allow the substrates to be transferred between the second vacuum transfer module and the buffer station. At least one buffer chamber between the first vacuum transfer module interface and the second vacuum transfer module interface includes a lower pedestal, and the lower pedestal is configured to accommodate a substrate on the surface of a support portion. One or more semiconductor substrate storage shelves are placed on the lower pedestal. Each of the shelves is configured to accommodate the substrate from the first vacuum transfer module or the second vacuum transfer module, and to store each substrate on the shelf. |
