PRINTED CIRCUIT BOARD ASSEMBLY MANUFACTURING METHOD

摘要

In the present invention, disclosed is a manufacturing method for a printed circuit board assembly. The disclosed manufacturing method includes: a first step of spreading solder on a plurality of joining pads prepared on the printed circuit board at a first temperature; a second step of mounting a plurality of electronic components on the spread solder; a third step of joining the electronic components onto the printed circuit board using a heating technique; a fourth step of spreading underfill resin materials to reinforce the hardness of the electronic components; a fifth step of supplying liquid heat radiation materials onto electronic components which require heat radiation; a sixth step of mounting a shielding unit onto a shielding unit joining pad on the liquid heat radiation materials; and a seventh step of hardening the underfill resin materials and the liquid heat radiation materials, and joining the shielding unit using a heating device at the same time.