| 发明名称 | Heat dissipating substrate, and element equipped with same | ||
| 摘要 | A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm. | ||
| 申请公布号 | US9332631(B2) | 申请公布日期 | 2016.05.03 |
| 申请号 | US201314032302 | 申请日期 | 2013.09.20 |
| 申请人 | DAI NIPPON PRINTING CO., LTD. | 发明人 | Fukuda Shunji;Sakayori Katsuya;Takarabe Toshimasa |
| 分类号 | H05K1/02;H01L51/52;C08G73/10;H01L23/373 | 主分类号 | H05K1/02 |
| 代理机构 | Ladas & Parry LLP | 代理人 | Ladas & Parry LLP |
| 主权项 | 1. A heat dissipating substrate, comprising: a support base material having a thickness of 70 μm or more, the support base material being a metal or a semiconductor material; an insulating layer formed directly on the support base material; and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by a non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm and the support base material has a thickness of 70 μm or more. | ||
| 地址 | Tokyo-to JP | ||