Insulation circuit and communication equipment

摘要

Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view.

主权项

1. An insulation circuit comprising:
a first pattern formed on a first layer of a board and receiving an RF signal; a second pattern formed on the first layer next to the first pattern, the second pattern outputting the RF signal received by the first pattern; a third pattern formed on a second layer different from the first layer of the board so as to overlap the first and second patterns respectively when seen in a plan view manner, the third pattern connecting to a signal ground; and a fourth pattern formed on the second layer next to the third pattern so as to overlap the first and second patterns respectively when seen in a plan view manner, the fourth pattern connecting to a frame ground.