发明名称 |
Hybrid bonding and apparatus for performing the same |
摘要 |
A method includes performing a hybrid bonding to bond a first package component to a second package component, so that a bonded pair is formed. In the bonded pair, first metal pads in the first package component are bonded to second metal pads in the second package component, and a first surface dielectric layer at a surface of the first package component is bonded to a second surface dielectric layer at a surface of the second package component. After the hybrid bonding, a thermal compressive annealing is performed on the bonded pair. |
申请公布号 |
US9331032(B2) |
申请公布日期 |
2016.05.03 |
申请号 |
US201313787566 |
申请日期 |
2013.03.06 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liu Ping-Yin;Huang Xin-Hua;Huang Chih-Hui;Chao Lan-Lin;Tu Yeur-Luen;Lu Yan-Chih;Sze Jhy-Jyi;Tsai Chia-Shiung |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method comprising:
performing a hybrid bonding in a pre-bonding station to bond a first package component to a second package component to form a bonded pair, wherein first metal pads in the first package component are bonded to second metal pads in the second package component, and a first surface dielectric layer at a surface of the first package component is bonded to a second surface dielectric layer at a surface of the second package component; wherein after the hybrid bonding, the first metal pads are bonded to the second metal pads through direct metal-to-metal bonding, and the first surface dielectric layer is bonded to the second surface dielectric layer through fusion bonding; after the hybrid bonding, transferring the bonded pair from the pre-bonding station to a thermal compressive annealing station; and in the thermal compressive annealing station, performing a thermal compressive annealing on the bonded pair. |
地址 |
Hsin-Chu TW |