High-density server aggregating external wires for server modules

摘要

A high-density server includes a plurality of server enclosures, each of which includes an enclosure frame with a pair of front decks and a rear opening, an enclosure element having a power supply unit, and a pair of server modules having module connectors. The enclosure element is positioned in the rear side of the enclosure frame. The module connector of the server module is detachably connected to the front connector of the power supply unit when the server module moves along the front deck in an insertable/removable manner inside the enclosure frame. A cooling fan is positioned in the front side of the server module relative to the rear opening of the enclosure frame. An external interface is attached to the rear end of the server module or installed in the enclosure element, thus preventing a mess in the front face of the server enclosure due to external wires.

主权项

1. A server enclosure comprising:
an enclosure frame having a front drawer, which further includes multiple pairs of left/right openings which are vertically combined together on a front face, and a rear opening which is opened on a rear face; a power supply unit positioned inside the enclosure frame; a front connector electrically conducting to at least the power supply unit; an enclosure element positioned at a rear end inside the front drawer of the enclosure frame which includes at least the power supply unit and in which the front connector is positioned in a front side; a computer unit which operates based on power supplied by the power supply unit; a module connector which electrically conducts to at least the computer unit and which is connected to the front connector in a freely-detachable manner; a server module which is equipped with at least the computer unit, which is equipped with the module connector at a rear side, and which is installed in the front drawer of the enclosure frame in a freely-insertable/extractable manner in a front-rear direction; and a plurality of cooling fans in close proximity to each other, wherein multiple pairs of left/right server modules are vertically placed and individually installed in the front drawer of the enclosure frame in a freely-insertable/extractable manner, wherein multiple pairs of left/right module connectors are vertically placed and individually installed in the vertically-placed multiple pairs of left/right server modules at their rear sides, wherein multiple pairs of left/right front connectors are vertically placed and positioned on the front face of the enclosure element, wherein the enclosure element is interposed between the vertically-placed multiple pairs of left/right server modules and shared by the vertically-placed multiple pairs of left/right server modules, wherein a plurality of power supply units is vertically combined together, and wherein the enclosure element includes a power connection mechanism establishing redundant multipoint-to-multipoint connections between the vertically-placed multiple pairs of rear connectors, which are connected to the vertically-placed multiple pairs of left/right power supply units in a freely-detachable manner, and the vertically-placed multiple pairs of front connectors, wherein the power connection mechanism comprises a pair of upper/lower printed circuit boards combined together using a single printed board vertically disposed therebetween.