POLISHING DEVICE AND POLISHING METHOD

摘要

The polishing device (1) is provided with: a processing vessel (10) into which the workpieces are inserted; a mobilization unit for mobilizing the workpieces inside the processing vessel; an abrasive-charging unit (30) for charging the abrasive in the direction of the workpieces; and a suction unit (40) for generating an air flow in which the abrasive moves in the direction that passes through the processing vessel (10) and for recovering the abrasive by suction. As a result of the air flow generated by the suction unit (40), the abrasive charged from the abrasive-charging unit (30) passes between the workpieces inserted in the processing vessel (10) while contacting the workpieces. The workpieces are thereby polished.