| 摘要 |
The device (100) has a transmission line (103) coupled to a ground line (104). The lines are formed on a face of a dielectric substrate (101), and interconnection is realized at the ends of the transmission line and the ground line, where the device is flexible over a part of its length located between electronic modules (110, 120) to be interconnected. An electrically floating metallization surface is formed on the upper surface of the substrate, and a coupling element (102) strengthens the electrical coupling between the two lines. |
